Products

A.1. - Classification according to structure:

A.1.1- Single-sided Printed Circuits Boards without through hole plating.

A.1.2- Double-sided Printed Circuit Boards with and without through hole plating.

A.1.3- Multilayer Printed Circuit Boards ( up to 18 layers).

A.2. - Classification according to lamination

A.2.1- Epoxy-glass laminated Printed Circuit Boards (FR4, FR5).
(up to 18 layers).

A.2.2- PTFE (Teflon) laminated Printed Circuit Boards and other lamination with a high dielectric constant (up to 6 layers).

A.2.3- Printed Circuit Boards with Polyamide lamination (up to 10 layers).

A.2.4- Printed Circuit Boards with BT lamination and high Tg modified epoxy resins to work at high temperatures (up to 14 layers).

A.3. -Classification according to construction:

A.3.1- Multilayer Printed Circuit Boards with buried and blind drilling.

A.3.2- Multilayer Printed Circuit Boards with inter-layer connections. (Sequential circuits).

A.3.3- Multilayer Printed Circuit Boards with external heat sinks made of nickel copper or passivated aluminium.

A.4. - Classification according to Electrical Characteristics:

A.4.1- Impedance controlled Printed Circuit Boards.

A.4.2- Printed Circuit Boards for Microwaves, Strip-Line, Micro-strip, etc.