Finishes

C. -TREATMENTS AND FEATURES

C.1- Direct Plating with Paladio.

C.2- Electrolytic Copper covering (Cu > 25µ thickness inside drills).

C.3- HAL ( Hot Air Leveling ) or Organic finish ( OPS ). RoHs compliant

C.4- Nickel and chemical gold for Bonding applications and flat Surfaces: high density PLCC, QFP, etc.

C.5- Ni / Au electrodeposits in connectors:

- Maximum Ni thickness: 10 u.

- Maximum Au thickness: 2,5 u.

· This is an extra finish along with other types.

C.6- Graphite conductor Ink application.

C.7- Black and brown oxidation for internal layers.

C.8- Photosensitive Solder-mask.

C.9-Components Marking:

-Silkscreen printing conventional application.

-Photosensitive inking for photographic applications.