Design

B. - DESIGN FEATURES

B.1. - Minimum conductor width: 0.10 m/m (100 u), Class V (3 inter-holes conductors at 2.54 m/m crossover)

B.2. - Minimum conductor-spacing distance: 0.10 m/m (100 u).

B.3. - Drilling and Pad diameter relation:

   Internal layers: Pad diameter = Hole diameter + 0,5 m/m.

   External layers: Pad diameter = Hole diameter + 0,4 m/m.

B.4. -Minimum drill finish size: 0,20 m/m (200 u).

(Drilling performed with 0,3 m/m of drill bit size).

B.5. -Maximum Ratio Aspect: 10/1

(Ratio Aspect = laminated thickness / drilling size).

B.6. -Superficial mounting components circuits SMT:

- Flat Pack, Gate arrays, Quat Flat Pack.

- 100 % Electrical test possibilities.

- Flat surface < 1 % out of the maximum PCB diagonal.

D. - MAXIMUM BOARD SIZES

D.1. - Single-side: 410 m/m / 530m/m.

D.2. - Double-side: 410 m/m / 530m/m.

D.3. - Multilayer: 410 m/m / 530 m/m.

D.4. - Special Laminate: subject to market standards.On Request.

Availability for standard exceeding measurements.On Request.